Hi Bev,
Just like George, I am struggling getting an understanding of you problem.
To me, 'head-on-pillow' solder defects are almost always caused by
insufficient peak temperature.
If these HOP's occurred essentially near the center of the BGA, you have your
answer,
If the HOP's are distributed over the whole array, than the root cause is not
insufficient peak temperature unless the whole reflow process is too low.
Werner
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