Hi Tom: I believe Rick is referring to assembly and not bare board
fabrication. Although your points on bare board fab are absolutely correct.
Nothing like the smell of Tetra Etch first thing in the morning.
The main difference in assembly is the lack of rigidity of the material. You
may need to do some fixturing in reflow. Also if these are multilayer boards
there is a potential for delamination during reflow because of the thermal
bonding film used for lamination.
You should not see any issues with wash.


Regards

Michael Barmuta

Staff Engineer

Fluke Corp.

Everett WA

425-446-6076



-----Original Message-----
From: Tom Waznis [mailto:[log in to unmask]]
Sent: Monday, February 24, 2003 8:00 AM
To: [log in to unmask]
Subject: Re: [TN] Teflon Substrate Processing?


No moisture to bake out. The process areas that need to change are Drill,
Electroless (add a step for pths)and Routing.

-----Original Message-----
From: Rick Thompson [mailto:[log in to unmask]]
Sent: Monday, February 24, 2003 7:06 AM
To: [log in to unmask]
Subject: [TN] Teflon Substrate Processing?


Hi,

We have a customer using Teflon substrates (I don't have details yet on
exact material) and I'm hoping someone can give me some feedback on any
special processing that might be needed working with these boards?
Additional baking, reflow profiles, washing, etc?

Thanks in advance.

Rick Thompson

Sr. SMT Process Engineer
SMTEK International, Inc.
+1 (805) 532-2800
[log in to unmask]

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