Hi An,

The latest issue of Circuits Assembly has an article on via-fill and
how it can be used to solve voiding issues in BGA solder joints. Don't
know the exact URL but you will find it under "recent addtions" on my
site http://www.smtinfo.net
Another suggestion is to check the Technet-archives, as this subject
has been discussed several times.

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net

>>> [log in to unmask] 04/14/03 12:58pm >>>
Hello,
I'm searching for information on filling of burried vias, blind vias,
and
micro-vias. The more information I can find the better.
Which technology is available? Conductive or non-conductive? Plating
or
screen-printing?  Which suppliers?
Which process do you use? How are your experiences with it? For which
purposes do you fill?
I thank you in advance.
Sincerely
An gielen

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