Hi An, The latest issue of Circuits Assembly has an article on via-fill and how it can be used to solve voiding issues in BGA solder joints. Don't know the exact URL but you will find it under "recent addtions" on my site http://www.smtinfo.net Another suggestion is to check the Technet-archives, as this subject has been discussed several times. Daan Terstegge Thales Communications Unclassified mail Personal Website: http://www.smtinfo.net >>> [log in to unmask] 04/14/03 12:58pm >>> Hello, I'm searching for information on filling of burried vias, blind vias, and micro-vias. The more information I can find the better. Which technology is available? Conductive or non-conductive? Plating or screen-printing? Which suppliers? Which process do you use? How are your experiences with it? For which purposes do you fill? I thank you in advance. Sincerely An gielen --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------