I have a copy of IPC-A-610, and PC-2221A, but neither gives me the
answer I'm looking for at the moment.  Soldering leaded components is
(usually) done bottomside; is it verboten to do topside soldering so as
to avoid clinching leads?  I find it much harder to replace components
when clinched.  I know electrolytics it can't be avoided for, and mono
caps probably shouldn't be topside soldered (they change color nicely);
but for resistors with nice long lead spans, is it a problem?  [8.1.11
in IPC-2221A]  I'm talking hand assembled boards, long-ish life (a few
years) but not space/life support/high temp/low temp/high speed designs
(test equipment).

Shawn Upton, KB1CKT
Test Engineer
Allegro MicroSystems, Inc
[log in to unmask]
603.626.2429/fax: 603.641.5336

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------