I have a copy of IPC-A-610, and PC-2221A, but neither gives me the answer I'm looking for at the moment. Soldering leaded components is (usually) done bottomside; is it verboten to do topside soldering so as to avoid clinching leads? I find it much harder to replace components when clinched. I know electrolytics it can't be avoided for, and mono caps probably shouldn't be topside soldered (they change color nicely); but for resistors with nice long lead spans, is it a problem? [8.1.11 in IPC-2221A] I'm talking hand assembled boards, long-ish life (a few years) but not space/life support/high temp/low temp/high speed designs (test equipment). Shawn Upton, KB1CKT Test Engineer Allegro MicroSystems, Inc [log in to unmask] 603.626.2429/fax: 603.641.5336 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------