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February 2001

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Fri, 16 Feb 2001 06:19:14 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, Craig Hillman <[log in to unmask]>
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Craig Hillman <[log in to unmask]>
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FR-4 is designed to be thermally matched to copper.

Craig


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Ken Fong
Sent: Friday, February 16, 2001 1:48 AM
To: [log in to unmask]
Subject: [TN] CTE mismatch


Dear Technetters,
Are there any models out there to assess the acceptability of a design which
seems to have CTE mismatch problem? The design in question has a larger and
rigid copper busbar to be reflow-soldered on an FR4 board. Thanks for any
advice.

KenF

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