Technet, 
I would like to have Technet clarify some questions that I have on OSP
boards. I got into a discussion with some other of my fellow Engineers
today about OSP and we had different opinions and ideas on several
topics related to this.

1.      What is the expected stockroom shelf life of  board? The boards
would sitting on a shelf, unwrapped and stacked one on top of the other.
2.      What happens to the coating after each heat cycle? Does the heat
dissolve the coating or does it make it just stronger and such more
difficult for the flux to penetrate the coating?
3.      Is there any time frame that you would try to complete the
entire assembly in? Would the assembly be more difficult to solder if
there was days between the reflow and wave time frames then if they were
all completed within hours?

thanks in advance
-Larry Koens-
 

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