Technet, I would like to have Technet clarify some questions that I have on OSP boards. I got into a discussion with some other of my fellow Engineers today about OSP and we had different opinions and ideas on several topics related to this. 1. What is the expected stockroom shelf life of board? The boards would sitting on a shelf, unwrapped and stacked one on top of the other. 2. What happens to the coating after each heat cycle? Does the heat dissolve the coating or does it make it just stronger and such more difficult for the flux to penetrate the coating? 3. Is there any time frame that you would try to complete the entire assembly in? Would the assembly be more difficult to solder if there was days between the reflow and wave time frames then if they were all completed within hours? thanks in advance -Larry Koens- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------