Hi Steve
 
Are all vias impacted or just some? If the latter, any common  
characteristics? (i.e aspect ratio, stack up, location in stack, etc.) For  shared 
edification, what are the materials in the set and  what are the cycling 
conditions and requirements? (at least so we can all  get a sense of what kind of 
unreasonable requirements might be out there looming  on the horizon) 
 
Season's best, 
Joe
 
 
 
 
 
 
In a message dated 12/22/2009 8:26:57 A.M. Pacific Standard Time,  
[log in to unmask] writes:

Hi  All,

We have a 6 layer flex that my customer has to thermal cycle at  
temperatures beyond the rated Tg's of the material- the end use environment is  about 
as bad as it gets. After repeated thermal cycles we start to see cracks  
develop in the glue layer used to bond the adhesiveless layers together. Will  
some kind of via fill help this issue?

Thanks in  advance.

Regards Steve Kelly





Steve Kelly (PLEASE  NOTE NEW E-MAIL ADDRESS)

(416) 750-8433 (work)

(416) 750-0016  (fax)

(416) 577-8433  (cell)




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