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ASSY- Bake for component re
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Subject: ASSY: Bake for component removal                 3/10/97   9:32 AM

Hello,

I am interested in getting your input about the bake out parameters that 
are used upon component removal from a PCB.

In the case where component failure analysis is required, bake of the
board is required to ensure that "popcorn" does not take place upon
component removal (for moisture sensitive devices).

1) What temperature do you use for bake ?
2) What time do you use for bake ?
3) Are there any concerns with using 125'C for 24 hours ? (close to board
   Tg) This is what one of our component suppliers recommends.

Thanks in advance for your input.

Charles Elliott
Process Engineer
Newbridge Networks



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