TECHNET Archives

November 2008

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
[log in to unmask]
Date:
Thu, 6 Nov 2008 10:49:30 +0800
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, "Liu, Zhong" <[log in to unmask]>
Subject:
Ask for help--peeling off solder mask after vertical immersion tin
MIME-Version:
1.0
Content-Transfer-Encoding:
quoted-printable
Content-Type:
text/plain; charset="us-ascii"
From:
"Liu, Zhong" <[log in to unmask]>
Parts/Attachments:
text/plain (21 lines) 
Dear TN experts,
               We encounter difficulty with peeling off solder mask
after vertical immersion tin. Specially, I should tell that the solder
mask thickness is enough to stand 5 times solderability test and with no
solder mask peeling off. Please kindly help give me some advises on it
to resolve.
Many thanks in advance.
Regards!
LZ
Sr. Engineer from Via

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2