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September 2005

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TechNet E-Mail Forum <[log in to unmask]>, Phil Nutting <[log in to unmask]>
Date:
Wed, 7 Sep 2005 12:53:52 -0700
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TechNet E-Mail Forum <[log in to unmask]>, Phillip Bavaro <[log in to unmask]>
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Phillip Bavaro <[log in to unmask]>
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Phil,

I have run HASL boards and ENIG boards side by side for years without incurring any issues through a Sn63 solder pot, with the exception of increased masking at times when they need flat ground pads.

But don't let that misguide you into thinking that wavesoldering using lead free solder and ENIG will not be without issue.

Phil


Phil Nutting <[log in to unmask]> wrote:
Good morning all,

As we move forward with RoHS compliance we are switching our board
plating from Tin/Lead HASL to ENIG. We are still running our Tin/Lead
wave solder system. Would you expect the new ENIG boards to run under
the same parameters as the HASL boards or would profiles need to be
changed?

Thanks in adavnce for your advice.

Phil Nutting

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