:)
Greg,
Right. Of course what people are going to do is dip 0201's holding the part with tweezers and then tell me "our parts solder fine, it must be your process". Yeah, right. And as you infer, if you use a wetting balance to get controlled dipping, then why not use it to (surprise, surprise) get DATA. Oh what fun.
Bev
-----Original Message-----
From: Munie, Gregory [mailto:[log in to unmask]]
Sent: May 8, 2003 10:11 AM
To: [log in to unmask]
Subject: Re: [TN] Wetting Balance Testing
Neil
I've done a lot of wetting balance but I have to add a few comments on the "dip and look." (I agree with all Bev's other comments and suggestions.)
The dip and look as it's traditionally done does deserve to die. But if done correctly it can tell you almost as much as wetting balance.
And I define correctly as:
1) Use ONLY water white rosin flux. NEVER use any activators in the flux.
2) Control your immersion (wetting balance is good for this :-)
3) Coverage criteria means nothing if you don't see active wetting, i.e. solder rises ABOVE the surface of the bath to wick UP the part lead.
# 3 is absolutely critical: in a real world soldering situation that is exactly what you want to happen for either wave or reflow soldering. It's what happens to the section of the lead that's NOT in direct contact with the solder that tells you whether the part is solderable.
Greg Munie
Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Thursday, May 08, 2003 4:25 AM
To: [log in to unmask]
Subject: Re: [TN] Wetting Balance Testing
Neil,
You also need to consider what alloy you are using. Dr. Lee of Indium has shown that 62/36/2 Sn/Pb/Ag gives significantly different results. And then there is the work Chris Hunt et al of the British NPL have done on lead free solders. And then are you using a solder globule or solder bath? Don't forget temperature, atmosphere (most likely air, unless like Chris you can afford a dry box) and preheat (or is that what you mean by hang time?). If you are using a globule block we have also found that how centered your component lead is over the solder globule affects your results as well.
I would say it is not so much the length of the lead (unless you are talking about something obscenely long - no comments please), but rather what the lead is connected to - like an internal heat sink. And, yes, we have had ONE problem with the heat sinking ability of a component affecting the results. I gave a short presentation to the J-STD-002 committee at APEX. I will send you a copy. It will not show up for other TechNetters, unfortunately. In essence, we found that wrapping the wetting balance clip in polyimide tape allowed the component in question to pass solderability testing!
All said, we have had excellent results using a wetting balance and much prefer it to the dinosaur "dip and look" test, which I would like to see DIE for SMT components. Now if we can just agree on what pass/fail criteria will be....
regards,
Bev Christian
Research in Motion
-----Original Message-----
From: Neil Flatter [mailto:[log in to unmask]]
Sent: May 8, 2003 1:17 AM
To: [log in to unmask]
Subject: [TN] Wetting Balance Testing
For those of you doing solderability testing, what sorts of parameters should we be concerned about for reliable results? Our tester already allows inputs for lead perimeter, cross sectional area, and hang time. My company's testing also specifies immersion angle, depth, and speed as well as the type of flux. By controlling these factors, can I expect repeatable results?
It has been suggested that we also need to limit the length of the leads for our testing as wall as installing a thermal break between the lead and the hanger. Both have been blamed for failing test results. Has anyone experienced changes in test results from these variables?
Neil Flatter
TRW-Automotive
Process Quality
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