Hi all,

What is the minimum vertical fill of solder for plated through holes ?

We have some problems to obtain the 75% requested by IPC-A-610 for a class 2
board.
In fact, the board has a thickness of 3,2 mm.
We use a no-clean flux and the wave is under nitrogen.

Is there any special criteria regarding to the thickness of the board ?
Has anyone succeeded in obtaining a correct solder filet for thick boards ?

Thanks,

Vincent Bada
Process Engineer
Alcatel Etca
Charleroi
Belgium

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