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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 8 Aug 2000 10:02:30 +1000 |
Content-Type: | text/plain |
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Hi Alejandro ,
you've just made me to open July's SMT issue bag:
Stencil Design for mixed tech placement & reflow.
It's yesterday's news, still, you may be interested.
it may even be on http://www.smtmag.com
paul
-----Original Message-----
From: Becerra Alejandro [mailto:[log in to unmask]]
Sent: Tuesday, 8 August 2000 9:28
To: [log in to unmask]
Subject: [TN] Issues in Soder Paste Printing
Hello TechNetters,
We are trying to better control our solder paste printing process.
Where can I find information about solder paste process?
I am looking for information about practices in the machine e.g.:
* Solder Paste handling
* Stencil cleaning
* Board cleaning
* Machine parameters (Temperature, printing speed)
* Amount of solder paste in stencil
* Inspection of solder paste deposits (SPC charts of height, size)
Thanks
Alejandro Becerra
Phone (915) 841-8518, Fax (915) 841-8518
[log in to unmask]
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