TECHNET Archives

August 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show HTML Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
copper cracking
From:
"Joan M.Slade" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 31 Jul 1999 10:13:28 -0400
Content-Type:
multipart/alternative
Parts/Attachments:
text/plain (258 bytes) , text/html (649 bytes) 
I have a question in regards to copper plating cracking on TeflonT materials.
The problem is only seen after ni / au plating. If the boards are flexed, the underlying copper cracks. What would cause this ?
We are baking the boards and removing humidity issues.

ATOM RSS1 RSS2