Subject: | |
From: | |
Date: | Fri, 3 Jan 1997 07:57:00 -0600 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Any data that you obtain would be of great interest to us. We also
operate in a similar environment and have not used BGA's because we
didn't think that they would stay on due to the thermal mismatch between
the board and the chip.
----------
From: OBRIEN GERARD
To: [log in to unmask]
Subject: qualification plan for BGA soldering process.
Date: Thursday, January 02, 1997 4:04PM
we would like to change over from QFP's to BGA in our assembly process
but before doing so I need to define the reliability test program for
the assembly process. The environment that the assembly will be used in
undergoes many thermal excursions during a day, -40C to + 30C is not
untypical.
Any suggestions regarding a specification that I can use as a starting
point. The BGA's will be plastic body up to 400 I/O's.
Regards.
************************************************************************
***
* TechNet mail list is provided as a service by IPC using SmartList
v3.05 *
************************************************************************
***
* To unsubscribe from this list at any time, send a message to:
*
* [log in to unmask] with <subject: unsubscribe> and no text.
*
************************************************************************
***
* If you are having a problem with the IPC TechNet forum please contact
*
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]
*
************************************************************************
***
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|