Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 14 Jun 2000 16:40:39 -0600 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Fellow tech netters,
I am trying to setup some pull test specs for our expoxy
process, we currently using a DEK screen printer and a FUJI FGL2 to
dispense glue. Does any one know what are the pull test (in pounds) for the
different components (example 0805, 1206, Tantalums, etc)?. I have found
that the only way of knowing if a populated board with glue is going to
withstand the handling is by having a pull test as a process measurement.
Any ideas?
Thanks
Jorge Rodriguez
Process Engineer
Conexant Systems
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################
|
|
|