Content-Type: |
text/plain; charset="iso-8859-1" |
Sender: |
|
Subject: |
|
From: |
|
Date: |
Fri, 17 Sep 1999 10:34:52 -0500 |
MIME-Version: |
1.0 |
X-cc: |
|
Reply-To: |
|
Parts/Attachments: |
|
|
Technetters
We are doing a double side reflow. What is the formula to determine the
maximum component mass double side reflow so the components will not fall
off during reflow. I realize it is also necessary to know the amount a
surface tension also necessary. Is there a point, such as 14 pin or less IC
that I can safely process through the reflow. What is the experience of the
industry? I appreciate any responses you can provide!
Donn E Steffen
Senior Quality Engineer
VDO Control Systems
Auburn, IN 46706
Phone (219)925-8887
Fax (219)925-8710
Email: [log in to unmask]
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################
|
|
|