Sender: |
|
X-To: |
|
Date: |
Thu, 5 Apr 2018 15:24:19 +0000 |
Reply-To: |
|
Subject: |
|
MIME-Version: |
1.0 |
Message-ID: |
|
Content-Transfer-Encoding: |
quoted-printable |
Content-Type: |
text/plain; charset="us-ascii" |
From: |
|
Parts/Attachments: |
|
|
From: Hernandez, Victor G
Sent: Thursday, April 5, 2018 10:22 AM
To: TechNet E-Mail Forum <[log in to unmask]>
Cc: Hernandez, Victor G <[log in to unmask]>
Subject: IPC-A-610G, section 5.2.9,, Solder anomalies-Fractured solder, Defect 1, 2, 3 (Axial leaded device)
Fellow TechNetters:
Is there a percentage associated with the statement "Fractures Solder" in the above stated IPC STD section?
I did not a similar statement, Fractured Solder, for Surface Mount Devices and Surface Mount Area.
Is there an acceptable percentage of the solder joint lead interface that can be fractured?
Victor,
|
|
|