Please advise re latest environmental and performance aspects of
popular photoresists used for etching, primarily for inner layers
including comparison of standard dry film versus liquid photoresists.

The possible photoresist (resist for etching of inner layers) issues
include:

 1) The liquid photoresist is thinner (typical thickness ?);
    a) more prone to handling damage ?
    b) provides controlled trace width (ex: possible 3-mil trace/space
       using an otherwise minimum 4-mil trace/space process) ?

 2) Etch rates (aside from isolated lines with solution movement better
    than for grouped lines);
    a) standard dry film etch rate range ?
    b) liquid photoresist etch rate range ?

 3) Potential problem chemicals such as carcinogens;
    a) does standard dry film contain any at-risk chemicals ?
    b) does liquid photoresist contain any at-risk chemicals ?

Thank you.

Regards,
Karl Sauter
408 276-5499
Sun Microsystems, Inc.



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