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Wed, 16 Apr 1997 13:11:17 -0700 |
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Hello TechNetters,
I am a bare board fabricator and writing on behalf of one of our customers.
They are having a solderability problem with one of the components, a press-fit
pin, and are seeking any advice I can collect.
These pins are .028" diameter and are pushed through .062" thick PC-75 laminate
until just .010" protrudes out the other side, and held in place by friction.
The .010" stub of the pin is surrounded by a pad to which solder paste is
conventionally applied and flowed. After soldering, inspection shows excellent
wetting of the pad surface, but *no bond to the pin*. Specifics of the pin
materials are not available at this time, but visually they appear to be tin-
coated brass. Mechanical scraping/brushing of the pin and hand soldering fixes
the problem, they obviously want to avoid this in production.
Personally, I think that the pin is being coated with resin as it is press fit
through the hole wall (this is not a plated-through-hole board). Can anyone
shed some light on this problem?
Thanks!
Bill Parlin
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