IPC is sponsoring a one-day IPC International Conference on Flexible
Circuits to be held on February 13, 2008 in Phoenix, Arizona. This
conference will be held in conjunction with the Interim meetings.
IPC is seeking speakers to present on the following topics but not
limited to:
New product application
Global market trends
Design strategies for flex
Material alternatives
Processing innovations
Fine line flex - increasing interconnect density
Flex assembly
Flex and lead-free
Flex in printed electronics
Fine pitch and high density packaging for flex
Reliability and testing data
Please send a brief abstract to Alexandra Curtis at
[log in to unmask] by December 7, 2007.
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