IPC is sponsoring a one-day IPC International Conference on Flexible Circuits to be held on February 13, 2008 in Phoenix, Arizona. This conference will be held in conjunction with the Interim meetings. IPC is seeking speakers to present on the following topics but not limited to: New product application Global market trends Design strategies for flex Material alternatives Processing innovations Fine line flex - increasing interconnect density Flex assembly Flex and lead-free Flex in printed electronics Fine pitch and high density packaging for flex Reliability and testing data Please send a brief abstract to Alexandra Curtis at [log in to unmask] by December 7, 2007. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------