Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 20 Feb 2002 16:57:32 -0500 |
Content-Type: | multipart/alternative |
Parts/Attachments: |
|
|
What you just wrote is a profile. But, more importantly, you said "lead
free". What alloy are you using? This profile looks too cool for lead free.
Bob
=======================
Robert Barr
Manufacturing Engineering
Formation, Inc.
Voice: 856-234-5020 x3035
Fax: 856-234-6679
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Dan R. Johnson
Sent: Wednesday, February 20, 2002 4:15 PM
To: [log in to unmask]
Subject: [TN] Safe processing window
A couple of questions for what has become my best engineering resource.
Management has asked me to provide a re-flow profile for our product, a
surface mount component built on FR-4 with lead free solder. I am reluctant,
I would prefer to generate a "safe processing window" type document. As
manufacturing professionals what do you prefer?
The window would spec ; max 2 C /sec ramp up, max 60 sec dwell above 180
C, max 220 C peak, and a 2 C/sec max ramp down. Could you live with this?
Many thanks for your help,
Dan
|
|
|