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July 2002

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Subject:
From:
Ray McKinnon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 2 Jul 2002 08:59:04 -0400
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Good morning all:

I am looking for guidelines for tenting via's.  Does IPC address this
issue if so what spec is it?  Will tenting vias become an cost addeder
from our board suppliers? Any suggestions on documenting this process?

Thanks for your comments.

Ray McKinnon
HNS

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