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Hi Ioan,
We use 4-mil thick stencils quite often and I don't see mid-chip balling...
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Monday, April 30, 2012 2:54 PM
To: [log in to unmask]
Subject: [TN] Homeplates on 4 mil thick stencils?
Dear Technos,
It is my first 4 mil stencil and I was wondering if mid-chip balling is
still an issue at this thickness (no-clean process). Should I still
homeplate the apertures of passives, as I fear insufficient solder?
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer T |
450.967.7100 ext.244 E | [log in to unmask] <mailto:[log in to unmask]> W |
www.digico.cc <http://www.digico.cc/>
N'imprimer que si nécessaire - Print only if you must
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