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June 1998

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Sender:
TechNet <[log in to unmask]>
Date:
Mon, 1 Jun 1998 13:09:08 +0000
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Bobby R. Mangona" <[log in to unmask]>
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Subject:
(Fwd) Termination Loss
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1.0
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From:
"Bobby R. Mangona" <[log in to unmask]>
Comments:
Authenticated sender is <bmangona@[192.1.1.215]>
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------- Forwarded Message Follows -------
From:          Self <bobby>
To:            TECHNET
Subject:       Termination Loss
Date:          Sat, 30 May 1998 08:45:51

We are experiencing termination loss of chip capacitors and chip
resistors after the reflow process.
Can anyone told me the possible causes?
Is it a material related problem?Since we have already checked the
reflow profile and found to be within specification.

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