See IPC-2221, para 6.3 and table 6-1 for general. See also figure 10-1
and 10-2 and para. 10 for beef-up/neck-down.
Bernhard

        ----------
        Von:  Mike Gish[SMTP:[log in to unmask]]
        Gesendet: Donnerstag, 24. Juni 1999 01:57
        An:  [log in to unmask]
        Betreff:   Re: [DC] PAD TO VIA SPACING

        it's based on your minimum spacing requirements and current
carrying
        requirements
        but there isn't a spec that describes a basic distance.  Keep in
mind other
        requirements also like design for testability and design for
manufacturability

        [log in to unmask] wrote:

        > Hello all,
        >
        > Can anyone tell me if there is an IPC standard for spacing
between a surface
        > mount pad and a feedthru?
        >
        > Thanks,
        > Mike W