See IPC-2221, para 6.3 and table 6-1 for general. See also figure 10-1 and 10-2 and para. 10 for beef-up/neck-down. Bernhard ---------- Von: Mike Gish[SMTP:[log in to unmask]] Gesendet: Donnerstag, 24. Juni 1999 01:57 An: [log in to unmask] Betreff: Re: [DC] PAD TO VIA SPACING it's based on your minimum spacing requirements and current carrying requirements but there isn't a spec that describes a basic distance. Keep in mind other requirements also like design for testability and design for manufacturability [log in to unmask] wrote: > Hello all, > > Can anyone tell me if there is an IPC standard for spacing between a surface > mount pad and a feedthru? > > Thanks, > Mike W