Hello Technetters:
I would like to have a rough picture of the industry's current practice re
solderability testing.
Anybody here who has adopted the Simulated Board Mounting Reflow
Solderability Testing (described in IPC's "Test S" of J-STD-002 and procedure
"3" of EIA/JESD22-B102) as an alternative to the Dip&Look and Wetting Balance
test for SMDs? Any concerns?
Would appreciate your response.
Regards,
Lei Tumibay