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Wed, 21 Jul 1999 22:12:22 EDT |
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Hi Brian,
It has been stated in the past, that above 100C near-eutectic solder creep
flow can be described using the Navier Stokes equation; I do not know on what
experimental evidence this statement is based, however.
I like to hear more about your "viscous flow model for low cycle fatigue."
How will you quantify the cyclic damage, and how will you relate this to
cycles-to-failure (however you define failure).
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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