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November 1997

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TechNet <[log in to unmask]>
Subject:
PIN-THROUGH PASTE PROCESS
From:
RAYMOND YONG <[log in to unmask]>
Date:
Thu, 6 Nov 1997 17:51:16 +0700
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"TechNet Mail Forum." <[log in to unmask]>, RAYMOND YONG <[log in to unmask]>
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Hi,

I am working on the qualification for PIN-THROUGH PASTE PROCESS.

Could you advise the IPC acceptable and rejectable soldering criteria for
the top and bottom side solder fillet for through hole joints.

Looking forward to your reply.

Thank You

Regards

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