came across some technical reference articles on behalf of AVX CORPORATION.:
     1) "Factors responsible for Thermal Shock Behavior of Chip Capacitors"
from the 37th Electronic Components Conference 1987, pp 145-156.
    by B. Rawal, R. Ladew, and R. Garcia.
      2) "Surface Mount Soldering Tchniques and Thermal Shock in Mulitlayer
Ceramic Capacitors" AVX Technical Information Series 1987 4pp.
   by J. Maxwell.
                            Hope it helps.      --Dean Lillibridge
                                                 NEWvENTURE TECHNOLOGIES
    -----Original Message-----
    From: TechNet [mailto:[log in to unmask]]On Behalf Of Kevin Stokes
    Sent: Thursday, August 16, 2001 4:26 PM
    To: [log in to unmask]
    Subject: [TN] To wave or not to wave, that is the question...


    Old problem: mounting ceramic capacitors to the bottom side of an
assembly and your customer wants you to wave them on.

    We are having problems with 0805 0.22 uF and 0.1 uF caps going through
wave and cracking during the process.  We are following all of the standard
protocols (preheat, etc.).  My understanding is that 0805s are typically
capable of handling this process.

    Anyone got any ideas short of moving the cap to the top or doing a
double sided reflow?

    Kevin

    Kevin Stokes
    Reliability Manager
    Kimball Electronics Group
    (812) 634-4207