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May 2000

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TechNet <[log in to unmask]>
Subject:
collapsible solder ball
From:
Roseann Strength <[log in to unmask]>
Date:
Tue, 16 May 2000 14:45:45 -0700
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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     Can someone please help me on this subject of BGA's?  Where do I find
     information (firstly) on defining a collapsible solder ball and where
     would that specific characteristic be found in the part data?  Also,
     if anyone can give me a 'heads up' on additional information our
     assembler may be requesting, I would appreciate it!
     Thanks

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