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| From [log in to unmask] Sat Apr 27 15: |
05:01 1996 |
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I recently heard reference to a lamination press cycle for multilayer PCB's
as a burp cycle. This cycle is intended to help with air entrapment I believe.
If anybody has any specifics on this cycle and or results of if it works or
not I would appreciate any and all feedback.
Thanx in advance.
brian
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