TECHNET Archives

1995

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipchq.com (Smail3.1.28.1 #2) id m0ssHKr-0000GmC; Mon, 11 Sep 95 17:28 CDT
Old-Return-Path:
<miso!hou.Sperry-Sun.COM!DDrake_at_SSDSRDCC>
Date:
Mon, 11 Sep 1995 16:57:04 -0500
Precedence:
list
X-Loop:
Resent-Sender:
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/1077
TO:
Return-Path:
Resent-Message-ID:
<"yv_X6.0.Sg9._VBLm"@ipc>
Subject:
From:
Resent-From:
From [log in to unmask] Sat Apr 27 14:
45:42 1996
Message-Id:
Parts/Attachments:
text/plain (22 lines)
     
     Does anyone have any experience at backboard heating for PTH 
     soldering? The laminate material is polyimide and is .090" thick.
     Typical components include radial and axial leaded devices as well as 
     DIP packages.
     
     We are trying to find ways to assist in high temp soldering (MP of 
     300degC or Eutectic @ 280degC). 
     
     What we are looking for are vendor recommendations and/or any 
     technical comments that may be available.
     
     Please fell free to contact me @ (713) 987-4365 or return Email to 
     DRAKE@SSDSRDCC
     
     Thanks in advance,
     
     Darrell Drake
     SSDS Sr. Process Engineer



ATOM RSS1 RSS2