Hello Le,
try to check your temperature, it follows a phase diagram as to what temperature
it has that composition
for example @ 183 C you have a eutectic, etc
Maybe your temperature is out of range

As to assembly probably re-flow temp have a slight change

Hope this helps






Le Dai Tri <[log in to unmask]> on 05/09/2000 04:16:19 PM

Please respond to "\"TechNet E-Mail Forum.\" <[log in to unmask]>,        Le Dai
      Tri" <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Jonathan A Noquil/Cebu/Fairchild)
Subject:  [TN] HASL Tin-Lead component in thin coating




TechNeter,

We use horizontal HASL machine. When I measured the thickness of tin/lead
    if the thickness was over 1um, the component of tin was 64~69%,
    if the thickness was under 1um (0.8~0.9um), the component of tin was always
over 70%.
    (Tin/lead made-up in solder pot was 63+/-3%; 37+/-3%; board thicness was
1.6mm)
I did'nt know the reason why?

In the case of component of tin was over 70%, what will happen in
PCB Assembly manufacturing?

Any help would be appreciated.

Best regards,
Tri'.

_______________________________________
PWB Development section
E-Mail    : [log in to unmask]