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Wed, 5 Aug 1998 11:28:20 -0700 |
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We are having difficulty in soldering a particular manufacturer's 240 Pin
(20 mil) PQFP using a standard reflow process. The defect we are seeing is
described as "pillowing effect" or "foot-in-the-mud effect" in which it
appears that the there is a wettability issue. The difficulty with this
failure is that it is very random in nature, although supposedly not
uncommon. If anyone has experienced a similar type of problem, PLEASE
respond with any information you can. Your contribution will be very much
appreciated. Thank you.
Chad Thibodeau
EF Data
Component Engineer
602 333-2138 Phone
602 921-9012 Fax
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