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July 1999

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TechNet <[log in to unmask]>
Subject:
wirebonding
From:
"Erat, Wolfgang" <[log in to unmask]>
Date:
Mon, 12 Jul 1999 15:10:40 -0400
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"TechNet E-Mail Forum." <[log in to unmask]>, "Erat, Wolfgang" <[log in to unmask]>
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Good Day

Would appreciate any and all input on reliability data / experience /
potential failuremodes when wirebonding Alu wire to electroless nickel /
immersion Gold boards.

HiRel Automotive application
wedgebonding
ultrasonic wire bonding
10 mil AL wire
Au 3 to 5 microns

appreciate your response

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