TECHNET Archives

May 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
Date:
Tue, 26 May 1998 16:19:16 +0000
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Edwin V. Maximo" <[log in to unmask]>
Content-type:
text/plain; charset=US-ASCII
Subject:
solder balls
MIME-Version:
1.0
Content-transfer-encoding:
7BIT
From:
"Edwin V. Maximo" <[log in to unmask]>
Comments:
Authenticated sender is <emaximo@[192.1.1.215]>
Parts/Attachments:
text/plain (22 lines) 
Can anyone tell me, would solder balls still occur when you have a
1:1 ratio between your solder mask and pad.

Any information will be appreciated.

Thanks,
Edwin Maximo
Electronic Assemblies Inc.
(632)7593884

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2