I might be exposing my ignorance but I was told there is never a stupid
question (just stupid people? ). I am looking at qualifying some
alternate materials for a BGA underfill appliation. I was wondering if
there are industry standards related to the underfill process and
applicable quality standards - i.e. void, coverage, excess squeegee out.
Also was interested if anyone could offer standard test methods for
vibration and thermal cycling that might be applicable.
Tom Gervascio
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