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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 24 Feb 2000 10:42:06 -0500 |
Content-Type: | text/plain |
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Hi Technetters,
We have now started dipping our boards, this is a BIG step down for you
guys, BUT, its a big step up for us.
The thing is the boards are giving us severe bridging problems.
We are using Kester 63/37 solder and, #971 flux, foamed, with OSP coated
boards.
The pot is set at 460, and we have tried hotter and cooler, with the same
result.
There is a film that forms almost instantly on the surface of the moten
solder which I think is the source of the problem, would working under
nitrogen help to eliminate this? In fact is blanketing with nitrogen a
viable solution?
HELP!!!
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