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February 2000

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Paul Tomlinson <[log in to unmask]>
Date:
Thu, 24 Feb 2000 10:42:06 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, Paul Tomlinson <[log in to unmask]>
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Hi Technetters,

We have now started dipping our boards, this is a BIG step down for you
guys, BUT, its a big step up for us.

The thing is the boards are giving us severe bridging problems.

We are using Kester 63/37 solder and, #971 flux, foamed, with OSP coated
boards.

The pot is set at 460, and we have tried hotter and cooler, with the same
result.

There is a film that forms almost instantly on the surface of the moten
solder which I think is the source of the problem, would working under
nitrogen help to eliminate this? In fact is blanketing with nitrogen a
viable solution?

HELP!!!


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