Vincent, your minimum is 75%, unless you have a thermal plaiting in your
board, which would allow a 50% fillet. For process improvement, check
your top temperature on the board before it hits the wave, a 190 to 210
degree F normally works well, although I've never tried it with
no-clean/nitro process.

> ----------
> From:         Vincent BADA[SMTP:[log in to unmask]]
> Sent:         Wednesday, September 29, 1999 11:32 PM
> To:   [log in to unmask]
> Subject:      [TN] Wave soldering
> Sensitivity:  Confidential
>
> Hi all,
>
> What is the minimum vertical fill of solder for plated through holes ?
>
> We have some problems to obtain the 75% requested by IPC-A-610 for a
> class 2
> board.
> In fact, the board has a thickness of 3,2 mm.
> We use a no-clean flux and the wave is under nitrogen.
>
> Is there any special criteria regarding to the thickness of the board
> ?
> Has anyone succeeded in obtaining a correct solder filet for thick
> boards ?
>
> Thanks,
>
> Vincent Bada
> Process Engineer
> Alcatel Etca
> Charleroi
> Belgium
>
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