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February 2000

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TechNet <[log in to unmask]>
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Brunker Ed <[log in to unmask]>
Date:
Wed, 23 Feb 2000 16:28:26 +0100
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Guenter Grossmann <[log in to unmask]>
Subject:
Re: PLASTIC MICRO-BGA
From:
Guenter Grossmann <[log in to unmask]>
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<[log in to unmask]>
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text/plain (24 lines) 
Ed

The idea of the underfill is to force the FR4 to deform not more than the
BGA. You must do the same if you want to mount a flipchip on FR4. Not very
elegant but effective.

Best regards

Guenter

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