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August 2001

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Subject:
From:
Charles Caswell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 30 Aug 2001 09:27:58 -0500
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-----Original Message-----
From: Howard Watson [mailto:[log in to unmask]]
Sent: Thursday, August 30, 2001 8:58 AM
To: [log in to unmask]
Subject: [TN] Any MELF experts?



Dear TechNetters, 

I have a situation involving a surface mount MELF Resistor, 270 ohm, 3W.
During environmental testing, one solder joint separated at the pad
causing intermittent failure.  Unfortunately, the technician repaired
the solder joint so I have nothing to evaluate.  Based on information
given to me, I suspect it was a mismatch of CTE between the MELF and the
PCB (FR4,.062).   

Does anyone have any experience, pad design or CTE data,  with large,
cylindrical MELF's?  This part is .5" x .156" dia.  and is custom
manufactured by RCD.  We are stuck with this part in surface mount, as
someone got a great "deal" on 100,000 or so parts, so it critical that I
prove reliability (or lack of) with the solder joints.  In advance, I
appreciate any information that can point me in the right direction. 

Howard Watson
Manufacturing Engineer
AMETEK/Dixson



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