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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 29 Sep 1998 14:49:08 -0700 |
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What kind of dry film soldermask do you intend to use? You might want
to look at the thickness of the dry film soldermask. That might be a
concern.
On Tue, 29 Sep 1998 13:40:37 PDT
glenn pelkey <[log in to unmask]> wrote:
> Does anyone see a problem with placing a via under a chip capacitor?
> The via will be tented with dry film soldermask. Assembly will be with
> epoxy or screened solder, reflow, and DI water clean.
>
> The potential for electrical shorts and remaining contaminates has us
> concerned.
>
> Thanks in advance for any input.
>
> Glenn Pelkey
> [log in to unmask]
> [log in to unmask]
> Maxtek Components Corp.
>
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Best Regards,
- Jay T. -
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