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| From [log in to unmask] Mon Mar 17 16: |
03:26 1997 |
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<19970313231010.AAA9126@[206.61.194.181]> |
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Technet,
We use an X-ray flourescence scope to measure solder
thickness and composition. Recently, we sent samples
to a university to have the composition measured by
Edacs (I probably spelled that wrong). In case I
spelled that wrong and you don't know what I mean -
Edacs composition measurements are a by-product of
scanning electron microscopes. Anyway, the tin-lead
percentages we got from Edacs were way different from
the results we got on our X-ray. I'm thinking this
might be because the Edacs measures an extremely small
surface area whereas the X-ray measures a 5 to 10 mil
diameter circle.
Does anyone have any experience with SEM and/or Edacs
in relation to solder composition? We would appreciate
any info to confirm my theory or refute.
Thanks,
Dave Hall
[log in to unmask]
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